Dice / Chips - Difused Silicon Wafers for Diodes

Type	:	Switching , Schottky and Zener Diodes (voltage range 3 3.3 V to 130 V in 0.5W, 1W, 1.3W and 2W range). Both bump type for axial mounting and wire bonding type for standard Die Attach mounting.
Technology	:	Silicon Planar
Passivation	:	Si3N4 / Phospho Silicate Glass
Wafer Size	:	4" wafers with primary flat
Die Sizes (typical)	:	10 x 10 mil2 , 11.6 x 11.6 mil2 , 14 x 14 mil2 , 18 x 18 mil2 , 21 x 21 mil2 ,32 x 32 mil2 .
Form of Supply	:	"Cut singulated dice in vial pack", for Axial and Mini MELF packages. In 4" Wafers, 100% electrically probed with bad dice inked "Diced on Mylar" for wire bondable packages like SMD SOT-23, SOD-323 and other packages.
Metallisation	:	Front side Aluminium (Al)  and back metallization silver (Ag) for axial glass packages. Front side silver (Ag) bump and back metallisation gold (Au) for wire bonding type packages.
Some Popular Transistor Dice Types	:	Zener Diodes For Axial Packages - CBZX55C Series, CBZX85C, C1N47XX Series, CBZX83C Series , CBS Series ( for tighter Vz tolerances). For SMD Wire Bondable Type Packaging - BZX84C Series, CMBZ Series. Switching Diodes For Leaded Axial and Mini MELF (SOD-80C) Packages – C1N4148, CLL4148 , BAV21 Series. For SMD SMD Wire Bondable Packaging – CBAS16, CBAV99 Dual, CBAV56 Dual, CBAV70 Dual , BAS21  Schottky Diodes BAT85 Series for axial packages BAT54 Series for wire bondable packages
Please forward specific requirement to CDIL for detailed specifications and commercials.

Printer Friendly Version